Kyocera AVX Chip Antennas Support System-in-package Applications

New antennas challenge miniaturization, performance, and cost optimization demands.

Kyocera's Antennas for SiP Applications.
Kyocera's Antennas for SiP Applications.
Kyocera AVX

FOUNTAIN INN, S.C. – Recently, KYOCERA AVX released a range of ultra-compact, high-performance 2.4GHz internal, on-board antennas optimized for multiprotocol System-in-Package (SiP) applications. The antennas address growing market demands for space-saving and cost-effective wireless components.

These antennas are engineered for seamless integration into SiP modules used in miniaturized devices requiring multiprotocol connectivity, including those for 5G, wearables, AI, IoT, autonomous vehicles, and healthcare applications.

Features & Benefits:

  • Designed for Bluetooth, Zigbee, Wi-Fi, Matter, and UWB protocols
  • Available models:
    • 1001312 Ceramic Antenna: 2.0 × 1.2 × 0.55 mm, 1.88 dBi gain, 62% efficiency
    • 9005868 Corner Chip Antenna: 1.0 × 0.58 × 0.35 mm, 4.0 dBi gain, 72% efficiency
    • 9001978 Ultra-Small Chip Antenna: 1.0 × 0.55 × 0.40 mm, 3.0 dBi gain, 65% efficiency
  • Tight RF field containment and excellent thermal tolerance (-55°C to +125°C)
  • A-Series automotive-qualified versions available
  • RoHS compliant and delivered in tape and reel packaging for automated assembly
  • Supported by downloadable PCB layout and simulation files (DXF, HFSS, CST)

Optimized for mass market, space-constrained applications such as smart tags, wearables, smart home sensors, and healthcare devices. Automotive-grade options support wBMS and TPMS applications.

KYOCERA AVX collaborates with STMicroelectronics through the ST Partner Program. Their antenna was selected for integration in ST’s new STM32WBA5M SiP microcontroller module.

For more details, visit KYOCERA AVX.

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