Mitsubishi Electric Corporation announced that its U.S. subsidiary, Mitsubishi Electric Power Products, Inc., released Chip-to-Grid DSX Reference Designs to support adoption of Nvidia’s Vera Rubin NVL72 rack-scale AI supercomputing system and next-generation in U.S. data centers.
The compay anticipates data centers will expand rapidly as a critical component of societal infrastructure. However, data center operators face major challenges in securing power, managing thermal conditions and ensuring stable operations to meet the increasing growth of AI.
Chip-to-Grid DSX Reference Designs encompass and coordinate systems from grid connection to chip power supply and direct-rack to facility-level cooling. This solution integrates Mitsubishi Electric’s power transmission and distribution equipment with next-generation power supply that incorporates advanced technologies and cooling systems. The designs also offer scalability to support future gigawatt-class data centers.
Data center sites will be equipped with on-site power generation and battery energy storage systems (BESS). During normal operation, this solution will minimize a site’s reliance on the grid, and in the event of a grid failure, the facility will switch to autonomous operation on its own microgrid, stabilizing power and operation.
The designs also support both conventional 415/480VAC and 800VDC power distribution within the data center. According to Mitsubishi Electric, the solution maximizes power efficiency by combining with a dual-loop cooling system suitable for high-density AI loads.
