Dymax
Dymax (Torrington, CT) introduced 9310 adhesive for advanced electronics and AI hardware. The 9310 adhesive is designed for reinforcing fine-pitch, leadless components on printed circuit boards while withstanding high-temperature reflow and can be used in complex electronic assemblies, printed circuit board (PCB) manufacturing and AI hardware production.
Features:
- Cures in seconds under light with secondary heat cure mechanism
- Formulated with high elongation (145%) and controlled modulus to absorb thermal expansion movement and reduce mechanical stress
- High viscosity, thixotropic profile that allows precise edge bonding without unwanted flow
- Maintains reliable adhesion through high-temperature reflow thermal cycles without compromising bond integrity
- Engineered to be reworkable at relatively low temperatures to support greater manufacturing flexibility
For more information, visit Dymax's website.
