There is no dispute that power densities have increased as enclosure volumes have gotten smaller. Packing components more densely reduces the circuit size and increases speed but leaves little room for heat dissipation. Vortec (Cincinnati, OH) has developed a white paper designed to help users reliably protect their electronics by using Vortec’s cooling methods. “Reliable Protection of Electronics in Ordinary and Hazardous Locations” offers information on alternatives to conventional cooling methods – specifically, how Vortex cooling can be safer and more reliable.
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