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Connectors Feature Lower Profile Header

They can reduce board stack height by 15%.

Model DHAL Mezza-pede SMT Connectors from Advanced Interconnections have a lower profile header.
Model DHAL Mezza-pede SMT Connectors from Advanced Interconnections have a lower profile header.
Advanced Interconnections

Advanced Interconnections (West Warwick, RI) has extended its line of Mezza-pede SMT Connectors with a new lower profile header (model DHAL) which reduces board stack height by 15%. The new design features:

  • A thin insulator that is 0.025" (0.63mm) thick. 
  • A z-axis stack height of 0.132" (3.4mm) when paired with mating socket model DHS. 
  • A shorter signal path in applications.
  • Suitability for 1.0mm pitch board-to-board and cable-to-board interconnections in high density electronic designs. 
  • Availability with 14 positions. 
  • Proprietary SMT lead frame and pin design. 
  • A unique over-molded lead frame in a precision-molded LCP insulator.
  • 30 microinches (µin) gold plating. 
  • Pass the 20-day mixed flowing gas (MFG) test, which is often required by demanding telecommunications applications. 
  • RoHS compliance. 
  • An operating temperature range from -55° to +125°C.
  • The ability to handle as much as 1.1 A current at +80°C.

For more information, visit www.advanced.com; or call 401-823-5200.

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