Master Bond (Hackensack, NJ) EP4G-80Med is a one part epoxy designed for use in the assembly of medical devices. This system is formulated with a non-metallic, graphite filler, which leads to good thermal and electrical conductivity. It possesses a thermal conductivity of 1.44-1.73 W/(m•K) and a volume resistivity of 50-100 ohm-cm. Furthermore, it complies with the ISO 10993-5 guidelines and is considered to be non-cytotoxic.
EP4G-80Med bonds well to a variety of substrates including metals, glass, ceramics, rubbers and many plastics. It is very effective as an EMI/RFI shielding compound and can also be used for static dissipation purposes. This system does not need high heat to cure; it cures readily in 60-90 minutes at 80°C. Post curing for 1-2 hours at 80°C is commonly recommended as it will optimize the overall properties of the epoxy. Its curing profile makes it suitable for many applications involving heat sensitive substrates.