Underfill Epoxy Offers Thermal Conductivity and Electrical Insulation

It does not need excessive heat for curing and has a long working life at room temperature.

Masterbond
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Master Bond (Hackensack, NJ) EP29LPTCHT is a two component, low viscosity epoxy compound that can be effectively utilized for underfill and encapsulation applications. It does not need excessive heat for curing and has a long working life at room temperature. This system is electrically insulative and thermally conductive with very fine particle size filler material. EP29LPTCHT can be easily dispensed into tiny gaps and when used as an adhesive, it forms thin bond lines from 5 to 15 microns, resulting in a significantly low thermal resistance of 12-15 x 10-6 K•m2/W. EP29LPTCHT features excellent flow properties with an initial mixed viscosity of 5,000-15,000 cps.

www.masterbond.com/industries/underfill-encapsulants; 201-343-8983

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