Master Bond (Hackensack, NJ) EP30NG is a two part epoxy adhesive system developed for applications that require high thermal conductivity. It contains a specialty graphene filler which contributes not only to its high compressive strength, but also to its enhanced dimensional stability. EP30NG achieves an extraordinary thermal conductivity of 38.15 BTU-in/(ft2-hr-°F) [5.5 W/(m-K)] at room temperature while its compressive strength measures 22,000-24,000 psi upon cure. It has a low coefficient of thermal expansion of 24-26 x 10-6 in/in/°C and exhibits a Shore D hardness of 85-95.
EP30NG bonds well to a variety of substrates including metals, composites, ceramics, glass and many plastics. The service temperature range is -60°F to +300°F. The product is available in 30 cc jar kits, ½-pint kits and pint kits.