Master Bond (Hackensack, NJ) has developed epoxy adhesive systems that can be used at pressures down to 1 x 10-12 torr. Formulations meet NASA ASTM E595 standards and are employed in structural bonding/sealing, coating and potting/encapsulation type applications. These low outgassing compounds avoid contamination, weight loss and degradation, even at elevated temperatures. Specific grades resist solvents, alcohols, lubricants, mild acids, alkalies, are serviceable from 4K to 400°F and have excellent insulation characteristics. These products adhere well to glass, ceramics, most plastics and metals such as austenitic stainless steel, mild steel, aluminum/aluminum alloys, bronze, nickel and brass.
These low vapor pressure materials play a valuable role in chemistry, physics and biology research. They are also used in many industrial processes including drying, distillation, mechanical handling, packing, forming and filtration.