Indium Corporation (Clinton, NY) is redefining solder with its reinforced solder alloy fabrications, InFORMS. InFORMS solder preforms and patent-pending ribbon are composite preforms consisting of solder with a reinforcing matrix. This results in:
- Improved mechanical and thermal reliability.
- Uniform bondline thickness.
- Low-voiding performance.
InFORMS do more than just bond two surfaces. These solder preforms were designed to address some specific challenges to the power electronics industry. InFORMS provide engineers with an enhanced material for the development of more reliable and higher performance modules. Due to the planarity improvements and stand-off tolerances, the package design becomes more predictable. In addition, stronger and more dependable joints allow for high power densities.
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www.indium.com/informs; 315-853-4900