Bowman (Schaumburg, IL) has debuted an important addition to its suite of benchtop XRF plating measurement systems. Bowman’s G Series XRF is a robust system that’s ideally suited for the analysis of precious metals – also tin or nickel - on printed circuit boards, wafers, connectors and other electronic components. Its two most distinctive features are “bottom-up” measurement using a motorized Z-axis with laser-based autofocus, and precision video imaging. An available manual XY stage with 1.5 X 1.5” travel facilitates easy positioning of small and large parts. Benefits include:
- A standard configuration which includes a single fixed collimator, solid-state PIN detector and long-life micro-focus x-ray tube. As with all Bowman models, the components can be upgraded to include multiple collimators, a variable focal camera or an SDD detector.
- The ability for instruments to simultaneously measure up to 5 coating layers, 10 elements in each layer; up to 25 elements in all. Element range is Al (13) through U (92.)
- Advanced Xralizer software, to quantify coating thickness from the detected photons. Xralizer combines intuitive controls with time-saving shortcuts, extensive search capability and "one-click" reporting.
Bowman’s G Series desktop XRF is ideal for quality labs and production environments. It is highly advantageous for users with limited benchtop space - or budget limitations. G Series XRFs are ideal for both plating thickness and solution analysis.