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Thermoelectric Modules Designed for High-Temp Environments

Proprietary construction prevents degradation in high heat applications.

Thermoelectric modules from Laird protect critical electronic devices in emerging applications found in high temperature environments
Thermoelectric modules from Laird protect critical electronic devices in emerging applications found in high temperature environments
Laird

Laird (North Carolina) has expanded its thermoelectric module (TEM) product family to protect critical electronic devices in emerging applications found in high temperature environments. The HiTemp ET Series features:

  • Spot cooling to ensure max temp of device is not exceeded in ambient environments.
  • Applicability in outdoor environments with a max temp of 60°~70°C.
  • 53 available models with a range of heat pumping capacities, geometric form factors and various input voltages to cover the a range of applications.
  • An enhanced construction that prevents copper diffusion, which commonly occurs in higher temperature environments and prevents degradation in their performance.
  • A high coefficient of performance (COP) to allow for maximum heat rejection into air environment even with poor heat sinking.

For more information, visit https://lairdthermal.com//products/product-series/hitemp-et-series

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