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Die Adhesive Preserves Thermal Conductivity

It avoids tailing and dispenses smoothly.

Master Bond

Master Bond (Hackensack, NJ) offers its EP3HTSDA-1 single part, no mix epoxy adhesive for die attach applications. Features include:

  • A die shear strength of 20-22 kg-f.
  • Thermal conductivity of over 40-45 BTU•in/ft2•hr•°F.
  • Solid formulation that avoids tailing and dispenses smoothly.
  • Curing time of 20-30 minutes at 250 degrees Fahrenheit, or 5-10 minutes at 300 degrees Fahrenheit.
  • NASA low-outgassing approved.
  • A Shore D hardness of 75-85.
  • Can be used on metals, ceramics, and silicon dies at temperatures ranging from -80 to 400 degrees Fahrenheit.

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