Master Bond (Hackensack, NJ) offers its EP3HTSDA-1 single part, no mix epoxy adhesive for die attach applications. Features include:
- A die shear strength of 20-22 kg-f.
- Thermal conductivity of over 40-45 BTU•in/ft2•hr•°F.
- Solid formulation that avoids tailing and dispenses smoothly.
- Curing time of 20-30 minutes at 250 degrees Fahrenheit, or 5-10 minutes at 300 degrees Fahrenheit.
- NASA low-outgassing approved.
- A Shore D hardness of 75-85.
- Can be used on metals, ceramics, and silicon dies at temperatures ranging from -80 to 400 degrees Fahrenheit.
