Used to bond aluminum panels and copper heat exchange tubes, Aremco-Bond 568 is aluminum-filled epoxy system that offers thermal conductivity of 9 Btu-in./hr-ft²°F and flexural and tensile strength of 11,400 and 2,500 psi, respectively. Resistant to acids, bases, salts, and organic fluids, it mixes in 1:1 ratio by weight or volume, cures at room temperature or with low heat, and provides total mass loss of 0.75% at 125ºC and 0.35% of collected volatile condensable materials at 25ºC.