Model EP30M3LV is specially engineered, low exothermic epoxy system formulated to help avoid excess heat buildup and damage to thermally sensitive components during potting operations. It also contains special additive to remove air bubbles. Compound cures at room temperatures or more rapidly at elevated temperatures. It can be cured in various cross section thicknesses. Compound has volume resistivity of 2 x 1015 ohm cm at 25°C. It has convenient 2 to 1 mix ratio by weight and advantageously low mixed viscosity of 2,000 to 3,000 cps.