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Epoxy Compound boasts low thermal expansion coefficient


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Epoxy Compound boasts low thermal expansion coefficient

EP30LTE-LO, formulated with polymeric and inorganic materials, features dimensional stability and performance for bonding, sealing, casting and coating applications in aerospace, electrical, electronic, chemical, optical, and computer industries. Two-component epoxy offers low thermal expansion coefficient. Epoxy is serviceable over temperature range of -60°F to 250°F and cures at room temperature with 85% of its maximum strength within 48 hours. EP30LTE-LO features low coefficient of thermal expansion of 12x10-6 in/in/°C and shrinkage rate of less than 0.0002 in/in. It bonds to metals, glass, ceramics, wood, vulcanized rubbers and most plastics.

Master Bond Inc.
154 Hobart St
Hackensack, NJ 07601-3922

201-343-8983
www.masterbond.com


Master Bond Inc. is a leading manufacturer of high performance adhesives, sealants, coatings, potting and encapsulation compounds and impregnation resins. Our line of products consists of epoxies, polyurethanes, silicones, acrylics, polyamides and latex systems. They also include such specialties as anaerobics and cyanoacrylates. One and two component systems are available. Systems cure at room temperature, exposure to heat and upon exposure to UV... more info »

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