EP30LTE-LO, formulated with polymeric and inorganic materials, features dimensional stability and performance for bonding, sealing, casting and coating applications in aerospace, electrical, electronic, chemical, optical, and computer industries. Two-component epoxy offers low thermal expansion coefficient. Epoxy is serviceable over temperature range of -60°F to 250°F and cures at room temperature with 85% of its maximum strength within 48 hours. EP30LTE-LO features low coefficient of thermal expansion of 12x10-6 in/in/°C and shrinkage rate of less than 0.0002 in/in. It bonds to metals, glass, ceramics, wood, vulcanized rubbers and most plastics.