Model 9422-SC is component ruggedizing and staking material engineered to hold critical components, such as ball grid arrays and video graphics arrays. Light-curable adhesives dispense and cure in seconds to provide the optimal balance of production efficiency and technical performance. Adhesive helps enhance shock and vibration resistance of electronic assemblies. Bead shape is designed to wet both the board surface and component edge without seeping into shadowed areas. Material is highly thixotropic for zero movement prior to cure.