Formulated for chip-on-board LED assemblies Light-Cap Series acrylate encapsulating resins form strong bonds to plastic and other substrates including UV-absorbing clear or tinted grades of glass and plastics and semitransparent materials such as Learn more

Hysol Type 3323/3327/ 3329 encapsulates wire-bonded dies used in Smart Card ICs Dam-forming high-viscosity Type 3323 has thixotropic nature Fill-encapsulating Types 3327 and 3329 are low-viscosity materials with glass transition temperatures (Tg) Learn more

IEN What are the major concerns facing providers of assembly technology and related products and services in the next few years?Bachmann Issue #1 Education. There are so many adhesive and fastening alternatives that customers have trouble choosing Learn more

Speed safety and flexibility issues are driving the adhesive and lubricant industries to develop an arsenal of new products for today's ever more demanding industrial applications IEN brings you a sampling of some of these breakthroughs below For Learn more

Resin consumption in electronic components is comprised of a select group of engineering thermoplastics (ETPs) led in volume by nylon and thermoplastic polyesters Based on value however higher performance resins such as polyphenylene sulfide (PPS) Learn more