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Universal Expands High-Speed Placement Range


Universal Instruments has trimmed the footprint and increased the maximum board size for its high-speed placement platform. The result is more flexibility in a smaller shop-floor space. And because the new 4797R HSP accepts up to 96 feeders, these advantages are not achieved at the expense of lower throughput or complicated scheduling. Placement speed is maintained at 48,000 cph.

The 4797R HSP is capable of handling boards up to 24 in. (610 mm) length x 18 in. (460 mm) width. Universal has achieved this within a small footprint machine measuring 122 in. (3,100 mm) long and 84.8 in. (2,155 mm) deep. As well as maximizing throughput and flexibility, the new machine also emphasizes placement accuracy. Three-sigma accuracy is 0.08 mm for MELFs and small chips, and 0.05 mm for leaded components.

"Today''s OEM, EMS, and ODM businesses insist that every inch of the shop floor should deliver maximum productivity," said Heinz Dommel, systems manager of Universal Instruments. "But the flexibility to run high-value products such as backplanes opens up profitable opportunities. The 4797R HSP combines outstanding flexibility and space efficiency, without compromising on throughput or accuracy."

This is the most compact 4797-series HSP machine to feature large board handling capability. Accepting up to 72 unique components on standard 8 mm tape feeders, or 96 unique components with dual-track feeders, the 4797R HSP balances small footprint, easy scheduling, and high throughput. As well as 48,000 cph placement performance, the 4797R HSP has a minimum placement tact time of 0.075 seconds. Feeder axis tact time is 0.09s, or 0.08s with the dual-track feeder.

The new 4797R HSP can operate as a standalone machine, or grouped with multiple machines for increased flexibility and volume. It is ideal for assembling high volumes of standard products, as well as larger panels such as backplanes for networking or server applications, or PC motherboards. And its wide component range makes it equally productive in high mix environments.

Additional standard equipment includes twelve 5-spindle, advanced direct-drive placement heads, and Universal''s UCT53 software for offline programming. Available options include component library data teach, pattern program data teach, Barcode Validation System (BVS), traceability package, BGA/CSP recognition, black light PEC camera, and GEM/SECS II.

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