Master Bond views that the direction of assembly technology will increasingly emphasize the utility of adhesives, sealants, potting compounds, and coatings over conventional mechanical fasteners and assembly devices. Specific advantages of these newer technologies include lighter weight, virtual elimination of corrosion problems, reduced manufacturing steps, higher productivity, and the use of a semiskilled work force. As a result of all of these improvements, manufacturers will see greater reliability and service life from their products as well as a reduction in costs for equipment, maintenance, and related products.
The extensive use of adhesives and sealant systems is playing a pivotal role in the design and manufacturing of practically every advanced consumer and industrial product reaching the marketplace today. Devices such as cell phones, computer chips, medical stents, fiberoptical equipment, implantable devices, orthopedic appliances, aerospace components, athletic equipment, oil drilling equipment, all benefit from the use of adhesives. Adhesives and sealants help reduce costs, improve reliability, reduce equipment weight, and are user friendly.
Master Bond Inc considers some of the most significant assembly areas that will take full advantage of the newly developed high performance and easy-to-use adhesive and sealant formulations will be in the continuing movement toward miniaturization of electronic devices with increased performance capabilities. One example is the computer chips that are being loaded with components offering greater versatility and longer durability. These will result in increased temperatures and hence a very real need for thermally and/or electrically conductive adhesive systems in order to prevent excessive temperature buildup, which would deleteriously affect service life. Optoelectronics demands lightweight interconnects as well as high optical transmission, which must be retained even upon prolonged exposure to laser light, UV light, and elevated temperatures. Telecommunication equipment is certain to take full advantage of the potential offered by advanced optoelectronic adhesive and sealant systems presently being commercialized. Adhesives and sealants will also play a vital role in the development of miniaturized biocompatible medical devices that can be safely implanted into human bodies. Sensors and other control devices for practically every industrial manufacturing process will take advantage of the lightweight and non-corrosive nature of modern adhesive and sealant compositions.
Master Bond Inc. has pioneered the development of adhesive and sealant compounds specially designed to best meet the needs of very specific applications and end product requirements. Our company has, for example, formulated thermally and also electrically conductive adhesives, which greatly enhance both service capabilities and durability of the most advanced microelectronics products built by major U.S. and overseas companies. Master Bond offers Master Bond Supreme 10AOHT as a fast curing, one part, thermally conductive system, and Supreme 10HT/S as a one part electrically and thermally conductive epoxy. Both have outstanding performance properties and convenient handling. UV light curable formulations, which can cure in seconds, have been developed by Master Bond and play a major role in the manufacture of catheters and many other biocompatible medical devices. Additionally, Master Bond offers a number of epoxies and UV curables that meet USP Class VI biocompatibility requirements. Master Bond's epoxy-based Polymer System EP42HT has become the "gold standard" for reusable medical devices subjected to repeated sterilizations. Master Bond's UV15-7 and UV15 are examples of UV curable adhesives/sealants that are prominent for high performance "cure-on-demand" optoelectronic assemblies. As to the future, there is the glittering promise of nanotechnology for further improvements in both performance and size reductions!
