RF Module uses 1/3 less power than other Bluetooth devices

Filter, inductors, and capacitor of RF module are embedded into Low Temperature Co-fired Ceramics (LTCC) substrate. Flip chip assembly mounts semiconductor. Communications device measures 0.276 x 0.276 x 0.071 in. and incorporates silicone wave RF chipset with Bluetooth 1.1-compliant Class 2 (max 4 dBm) output.

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Inductor is compact yet efficient

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RF Module uses 1/3 less power than other Bluetooth devices

view allRelated Headlines

Selecting Vibration Monitoring Instruments

Opto 22 Opens Representative Office in China

Metallization of Ceramics – Pushing the Boundaries

Preventing VFD/AC Drive Induced Electrical Damage to AC Motor Bearings

view allRelated PRODUCTS

Inductor is compact yet efficient

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