Robust materials of Microlam Series 600 meet environmental tests for chip packages. Model 610 serves as drop-in replacement for resin-coated copper, and consists of FR-4 epoxy resin for microvia/wireless device pcbs. Moisture-resistant Model 620 is made of thermoset resin for chip package substrates. BT resin Model 630 accommodates Bluetooth modules, tranceivers, and high-speed telecom pcbs.