Expanded PTFE materials impregnated with various filled resins solve specific application needs. Microlam Type 200 exhibits low loss tangent (0.0036-10 GHz), making it suitable for high-frequency, laser HDI-printed wiring boards and RF modules. Thermal expansion coefficient of 19 ppm/°C makes Type 400 isotropically matched to copper, allowing fabrication of fine-pitch chip package substrates. Reliability, drillability, and high microvia hole quality make Type 600 suitable for buildup layers. All improve signal speed without compromising signal integrity.